SHIPPING WORLDWIDE.  

This is an amazing tacky flux for surface mount rework.
We are able to remove and resolder a number of parts that were impossible using normal liquid flux.
Some TSOP's, PLCCs, SSOP's...all were a ton easier to remove and resolder.
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• Remove QFDs, PLCCs, SOICs and chip components without costly equipment
• Use with existing rework equipment or temp controlled soldering irons
• Special removal alloy has excellent wetting ability
• Safe, affordable, easy and won't damage sensitive components

Features:

1: This product is no-clean solder paste, very little residue, without washing.

2: The residue is colorless and transparent appearance outstanding.

3: Excellent printing performance with suitable hand and machine print.

Is currently the best on the market BGA, CSP rework help paste.

Just apply a little each time

Specifications:

Capacity: 10CC

Model: NC-559-ASM

Color: As shown

Suitable for BGA ball, semiconductor packaging, repair.

Computer motherboard north and south bridge, communications,

graphics and other BGA apply.

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🌎 Worldwide Shipping ✈  

Please do note that shipping is insured and takes 7-20 business days worldwide. However, you may receive your items earlier. Tracking Numbers will ALWAYS be sent so you can track it every step of the way! Cool things are worth waiting for! 😉

🔒 100% Risk-Free Purchase 🔥 

If the product you received is broken, don't worry. Just hit the Contact us button and send us a message, and we will make it right by offering you a replacement or refund. 100% Simple & Risk-Free process.

Our Warehouse

Once your order is dispatched, depending on your country or region, estimated delivery time is between 7 to 20 business days. Please consider any holidays that might impact delivery times.Please consider the transportation methods and unexpected situations that may affect the delivery time.